embedded wireless module

MC7330 is a second generation 4G-LTE module with or without voice and an integrated GPS+Glonass receiver primarily for Japan/NTT Docomo. Fall back to3GHSPA+/DC-HSPA+ and2GGSM/GPRS/EDGE. Supported frequency bands:4G-LTE 850/1500/2100,3G850/2100 and2G850/900/1800/1900. Form factor: PCIe Mini Card F1, 51x30 mm.

Ideal for industrial M2Mand mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies. Based on the PCI Express Mini Card standard with a USB interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

Features

Air interface:4G-LTE MIMO,3G-HSPA+/DC-HSPA+ Rx Diversity,2G-GSM/GPRS/EDGE, GNSS

4Gbands: 850/1500/2100 MHz

3Gbands: 850(B5,B6,B19)/2100 MHz

2Gbands: 850/900/1800/1900 MHz

Peak Data rate: DL 100 Mbps, UL 50 Mbps

GNSS (GPS+Glonass): Qualcomm

Form factor: PCIe Mini Card F1, 51x30x2.7 mm

Supply Voltage: 3.3 V nominal

Operating Temperature:-25°Cto +85°C

Control, software and features

Control options: AT Commands, GOBI API, QMI SDK

Drivers: Android, Linux, Windows

Connectors

System connector: 52 position Mini PCIe

Antenna RF connector: 3x U.FL (Main RF, Aux RF, GPS with DC bias)

Interfaces

USB 2.0 High Speed

Main radio disable

GPIO: 4

Flash LED output

SIM interface: 1.8/3V

Audio (optional, specific SKU)

Digital audio: PCM/I2S

4G: VoLTE to be released

3G/2G: Circuit Switched Fall Back (CSFB voice)

Echo cancellation

Noise reduction

DTMF